愛賽克底部填充膠39-ICH08_UNDERFILL
愛賽克底部填充膠39-ICH08_use for low temperature solder product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.






39-ICH08_愛賽克底部填充膠特長：
Liquid state
Property    Typical Value   Test Condition
Chemical    Epoxy (Black)
Specific Gravity                @25度
Thixotropic index             12s-1/120s-1
Viscosity     mPa·s        Cone plate type, 120s-1


Cured state
Property      Typical Value   Test Condition
Tensile Modulus         Gpa               25度, DMA
Tg                 120度                 DMS
CTE α1/α2         39/105  ppm/度         TMA
Tensile shear strength 16 Mpa               JIS K 6850
Volume resistivity x 1015Ω·cm     JIS K 6911
Surface resistivity x 1015Ω       JIS K 6911




愛賽克UNDERFILL底部填充膠39-ICH08相關產品：
衡鵬供應
愛賽克UNDERFILL底部填充膠39-ICH09