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GDM300晶圓研磨（Wafer Grinding）衡鵬
——又稱晶圓拋光/晶圓背拋/晶圓減薄






GDM300晶圓研磨（Wafer Grinding）特長：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
·Built in edge trimming system is available as an option for thin wafer process.
·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
·Less than Ra1A ultra luminance, ultra mirror surface is possible.






GDM300晶圓研磨（Wafer Grinding）相關產品：
衡鵬供應
GNX200BP晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding