97香蕉超级碰碰久久免费的优势_这里只有精品在线播放_欧美精品久久一区二区_久久天天躁夜夜躁狠狠躁2022_亚洲人成在线一二_亚洲午夜久久久影院_日韩高清电影免费观看完整版_国产亚洲成av人片在线观看桃_日韩在线免费高清视频_亚洲国产精品va在线_欧洲成人在线观看_久久久久久久国产精品_欧美在线性视频_国产精品久久久久久超碰_97超碰色婷婷_亚洲第一网站男人都懂

岡本Wafer Grinding（晶圓研磨）GDM300 
—采用全自動系統，從后磨到貼裝的連續過程








岡本Wafer Grinding（晶圓研磨）GDM300特長：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
采用全自動系統，從后磨到貼裝的連續過程，可研磨至25um厚度。
·With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
2個磨頭階段，產量幾乎是1個磨頭系統的兩倍。




·Built in edge trimming system is available as an option for thin wafer process.
內置修邊系統可作為薄型晶圓加工的選擇。




·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
雙指標體系，拋光階段和研磨階段完全分離，滿足TSV和MEMS工藝所需的清潔。
·Less than Ra1A ultra luminance, ultra mirror surface is possible.
超亮度小于Ra1A，可超鏡面。




了解更多：




岡本GDM300晶圓研磨（Wafer Grinding）相關產品：
衡鵬供應
岡本GNX200B/GNX200BH/GNX200BP/GDM300B晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding